No.

ITEM

TEST CONDITIONS

REMARKS

1

Thermal  Shock

(Temperature  Cycle)

Temperature:-40 o C/ +85 o C kept  stabilized

for 30 minutes each

Cycle: 100 Cycles

There must be no deformation or  change in dimension. Inductance must not change more than the stated  tolerance.

There must be no case deformation  or change in dimensions. Inductance must as specification stated.

There must be no case deformation  or change in dimensions. Inductance must as specification stated.

There must be no case deformation  or change in dimensions. Inductance must as specification stated.

There must be no case deformation  or change in dimensions. Inductance must as specification stated.

Solder inductors on the test  PCB.After vibration, there must be no deformation or change in dimension.  Inductance must not change more than the stated tolerance.

2

Humidity  Resistance

Humidity: 90%~ 95% RH

Temperature: 40± 2 o C

Test Time: 500± 12 Hours

3

HighTemperature

Temperature: 85± 2 o C

Humidity: 20%

Test Time: 500± 12 Hours

4

Low  Temperature

Temperature: -40 ± 2 o C

Test Time: 500± 12 Hours

5

Temperature  and

Humidity Cycle

6

Vibration

Frequency: 10Hz~50Hz

Amplitude: 1.5mm

Direction: X,Y,Z

Time: 2 Hours each

7

IR  Reflow Soldering

Solder: H63A(eutectic solder)

Solder Temp.: 232± 5 o C

Time: 6 minutes

Cycles: x 1

Inductance shall be within ± 20% of the initial value.DCR value shall be within ± 20% of the initial value.

8

Soldering  Heat

Resistance

Preheat:120 ~ 150 o C (60 sec)

Solder:H63A(eutectic solder)

Solder Temp.: 260 ± 5 o C

Flux: Rosin

Dip time: 10± 1 seconds

The chip must have no cracks.More  than 75% of the terminal electrode must be covered with

solder. For 96.5 Sn / 3.5 Ag  Solder Past: > 217 o C / 90 Seconds.

For 63.0 Sn / 37 Pb Solder Past:  > 183 o C / 120 Seconds.